QFN32-0.5 Burning Seat Chip Test Seat Flip Shrapnel Double-Layer Board Programming Seat, QFN32-0.5 – Flip
QFN32-0.5 Burning Seat Chip Test Seat Flip Shrapnel Double-Layer Board Programming Seat, QFN32-0.5 – Flip.
Key Features:
- Working frequency: high frequency
- Application range: integrated circuit IC
- Production process: injection molding
- Contact material: beryllium copper shrapnel
- Insulator material: PPS PET
- Number of cores: 32
- Name: QFN32 flip shrapnel to 152 test seat
- Purpose: programming socket and test socket, to program and test QFN32 IC chips
- Chip size: 5x5cm
- Pin spacing: 0.5mm
Package Info: Weight: 0.06kgs / 0.12lb, Size: 8cm * 8cm * 2cm / 3.15inch * 3.15inch * 0.79inch
Shipping: Shipping charges and final delivery dates are shown at checkout.